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M393B4G70BM0-YH9 Tech Specifications

Samsung  M393B4G70BM0-YH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Max. Access Time (ns) 0.255
Maximum Clock Rate (MHz) 1333
Chip Configuration 2Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.283/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Operating Current (mA) 3744
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks QuadRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support Yes
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
RoHS Non-Compliant
Part Status Obsolete
Pin Count 240
Organization 4Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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