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M393B2G70QH0-YK008 Tech Specifications

Samsung  M393B2G70QH0-YK008 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
HTS 8542.32.00.36
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Max. Access Time (ns) 20
Maximum Clock Rate (MHz) 670
Chip Configuration 1Gx4
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Operating Current (mA) 2800
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
CAS Latency 11
SPD EEPROM Support Yes
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 240RDIMM
RoHS Status RoHS Compliant
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M393B2G70QH0-YK008 Documents

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