Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply Twicea electronic parts stores,electronic components,electronic parts,electronics parts supply

M393B2G70DB0-YH9 Tech Specifications

Samsung  M393B2G70DB0-YH9 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) 4A994.a
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 36Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 1Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.35
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support No
Number of Ranks DualRank
CAS Latency 9
Standard Package Name DIMM
Supplier Package RDIMM
Mounting Socket
Package Height 30
Package Length 133.35
Package Width 4(Max)
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 2Gx72
Module Type 240RDIMM
RoHS Status RoHS Compliant
View Similar

M393B2G70DB0-YH9 Documents

Download datasheets and manufacturer documentation for   M393B2G70DB0-YH9

M393B2G70DB0-YH9 brand manufacturers: Samsung Electronics, Twicea stock, M393B2G70DB0-YH9 reference price.Samsung Electronics. M393B2G70DB0-YH9 parameters, M393B2G70DB0-YH9 Datasheet PDF and pin diagram description download.You can use the M393B2G70DB0-YH9 Memory Cards, DSP Datesheet PDF, find M393B2G70DB0-YH9 pin diagram and circuit diagram and usage method of function,M393B2G70DB0-YH9 electronics tutorials.You can download from the Twicea.