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M391A2K43BB1-CPB Tech Specifications

Samsung  M391A2K43BB1-CPB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

ECCN (US) EAR99
HTS 8542.32.00.71
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2133
Chip Configuration 1Gx8
Chip Package Type 78FBGA
Minimum Operating Supply Voltage (V) 1.14
Typical Operating Supply Voltage (V) 1.2
Maximum Operating Supply Voltage (V) 1.26
Operating Current (mA) 1125
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 16Chip Banks
CAS Latency 15
SPD EEPROM Support No
Supplier Package UDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
Package Width 3.9(Max)
PCB changed 288
Part Status Active
Pin Count 288
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 288UDIMM
RoHS Status RoHS Compliant
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M391A2K43BB1-CPB Documents

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