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- CL31B105KBHNNNE
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CL31B105KBHNNNE Tech Specifications
Samsung CL31B105KBHNNNE technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 22 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, MLCC | |
| Package / Case | 1206 (3216 Metric) | |
| Terminal Shape | WRAPAROUND | |
| Material | Ceramic | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Tape & Reel (TR) | |
| Series | CL | |
| Published | 1997 | |
| Size / Dimension | 0.126Lx0.063W 3.20mmx1.60mm | |
| Tolerance | ±10% | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Temperature Coefficient | X7R | |
| Applications | General Purpose | |
| HTS Code | 8532.24.00.20 | |
| Capacitance | 1μF | |
| Voltage - Rated DC | 50V | |
| Packing Method | TR, EMBOSSED PLASTIC, 7 INCH | |
| Depth | 1.6mm | |
| Case Code (Metric) | 3216 | |
| Case Code (Imperial) | 1206 | |
| Temperature Characteristics Code | X7R | |
| Multilayer | Yes | |
| Voltage | 50V | |
| Height | 1.6mm | |
| Length | 3.2mm | |
| Thickness (Max) | 0.071 1.80mm | |
| Thickness | 1.8034mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
CL31B105KBHNNNE Documents
Download datasheets and manufacturer documentation for CL31B105KBHNNNE
- DatasheetsCL31B105KBHNNNE Characteristics CL Series, MLCC Datasheet CL31B105KBHNNNE-Samsung-Electro-Mechanics-datasheet-8324245.pdf CL31B105KBHNNNE-Samsung-Electro-Mechanics-datasheet-11971793.pdf CL31B105KBHNNNE-Samsung-Electro-Mechanics-datasheet-81462469.pdf CL31B105KBHNNNE-Samsung-datasheet-59220082.pdf
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