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RFN2L6STE25 Tech Specifications

ROHM Semiconductor  RFN2L6STE25 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 21 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case DO-214AC, SMA
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature (Max.) 150°C
Packaging Tape & Reel (TR)
Published 2016
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Applications SUPER FAST RECOVERY
HTS Code 8541.10.00.80
Terminal Position DUAL
Terminal Form C BEND
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-C2
Configuration SINGLE
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 1μA @ 600V
Voltage - Forward (Vf) (Max) @ If 1.55V @ 1.5A
Operating Temperature - Junction 150°C Max
Voltage - DC Reverse (Vr) (Max) 600V
Max Reverse Voltage (DC) 600V
Average Rectified Current 1.5A
Number of Phases 1Phase
Reverse Recovery Time 35 ns
Non-rep Pk Forward Current-Max 40A
Reverse Current-Max 1μA
RoHS Status ROHS3 Compliant
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