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RF2001T3D Tech Specifications

ROHM Semiconductor  RF2001T3D technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Package / Case TO-220-3 Full Pack
Mounting Type Through Hole
Mount Through Hole
Diode Element Material SILICON
Number of Elements 2 Elements
Published 2001
Packaging Bulk
JESD-609 Code e1
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Applications VERY FAST RECOVERY
HTS Code 8541.10.00.80
Voltage - Rated DC 300V
Terminal Position SINGLE
Peak Reflow Temperature (Cel) 260
Current Rating 20A
Time@Peak Reflow Temperature-Max (s) 10
Base Part Number RF2001T3D
Pin Count 3
JESD-30 Code R-PSFM-T3
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 10μA @ 300V
Voltage - Forward (Vf) (Max) @ If 1.3V @ 10A
Forward Current 20A
Operating Temperature - Junction 150°C Max
Max Surge Current 100A
Forward Voltage 1.3V
Max Reverse Voltage (DC) 300V
Average Rectified Current 10A
Number of Phases 1Phase
Reverse Recovery Time 25 ns
Peak Reverse Current 10μA
Max Repetitive Reverse Voltage (Vrrm) 300V
JEDEC-95 Code TO-220AB
Peak Non-Repetitive Surge Current 100A
Reverse Voltage 200V
Diode Configuration 1 Pair Common Cathode
Recovery Time 25 ns
RoHS Status ROHS3 Compliant
Radiation Hardening No
Lead Free Lead Free
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