DAN217T146 Tech Specifications

ROHM Semiconductor  DAN217T146 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Tape & Reel (TR)
Published 2005
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
Termination SMD/SMT
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.70
Voltage - Rated DC 80V
Max Power Dissipation 200mW
Terminal Position AXIAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Current Rating 100mA
Time@Peak Reflow Temperature-Max (s) 10
Base Part Number DAN217
Pin Count 3
Qualification Status Not Qualified
Element Configuration Dual
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Standard
Current - Reverse Leakage @ Vr 100nA @ 70V
Power Dissipation 200mW
Voltage - Forward (Vf) (Max) @ If 1.2V @ 100mA
Forward Current 100mA
Max Reverse Leakage Current 100nA
Operating Temperature - Junction 150°C Max
Max Surge Current 300mA
Output Current-Max 0.1A
Forward Voltage 1.2V
Max Reverse Voltage (DC) 80V
Average Rectified Current 100mA
Reverse Recovery Time 4 ns
Peak Reverse Current 100nA
Max Repetitive Reverse Voltage (Vrrm) 80V
Peak Non-Repetitive Surge Current 4A
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 4A
Recovery Time 4 ns
Height 1.1mm
Length 2.9mm
Width 1.6mm
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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