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BA6566FP-E2 Tech Specifications
ROHM Semiconductor BA6566FP-E2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 6 Weeks | |
| Mount | Surface Mount | |
| Packaging | Tape & Reel (TR) | |
| Published | 1998 | |
| JESD-609 Code | e3/e2 | |
| Pbfree Code | yes | |
| Part Status | Not For New Designs | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 26Terminations | |
| Terminal Finish | TIN/TIN COPPER | |
| Max Operating Temperature | 60°C | |
| Min Operating Temperature | -35°C | |
| Max Power Dissipation | 1.35W | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.8mm | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Pin Count | 24 | |
| JESD-30 Code | R-PDSO-G26 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 2/7V | |
| Temperature Grade | OTHER | |
| Number of Circuits | 1Circuit | |
| Max Supply Voltage | 1.27V | |
| Min Supply Voltage | 1.15V | |
| Telecom IC Type | TELEPHONE SPEECH CIRCUIT | |
| Width | 5.4mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
BA6566FP-E2 Documents
Download datasheets and manufacturer documentation for BA6566FP-E2
- DatasheetsBA6566/F/FP
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