HC5513BIM Tech Specifications

Rochester Electronics  HC5513BIM technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Through Hole
Package / Case 22-DIP (0.400, 10.16mm)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tube
Series UniSLIC14
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 28Terminations
Terminal Finish TIN LEAD
Power (Watts) 1.5W
Terminal Position QUAD
Terminal Form J BEND
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PQCC-J28
Function Subscriber Line Interface Concept (SLIC)
Qualification Status COMMERCIAL
Number of Circuits 1Circuit
Current - Supply 2.25mA
Neg Supply Voltage-Nom -5V
RoHS Status Non-RoHS Compliant
View Similar

HC5513BIM Documents

Download datasheets and manufacturer documentation for   HC5513BIM

HC5513BIM brand manufacturers: Rochester Electronics, LLC, Twicea stock, HC5513BIM reference price.Rochester Electronics, LLC. HC5513BIM parameters, HC5513BIM Datasheet PDF and pin diagram description download.You can use the HC5513BIM Interface - Telecom, DSP Datesheet PDF, find HC5513BIM pin diagram and circuit diagram and usage method of function,HC5513BIM electronics tutorials.You can download from the Twicea.