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H11D1M Tech Specifications
Rochester Electronics H11D1M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Material | aluminium | |
| Exterior Housing Material | 1 | |
| Type of heatsink | extruded | |
| Heatsink shape | U | |
| Colour | black | |
| Material finishing | anodized | |
| Mounting | for back plate | |
| Internal width | 26.2mm | |
| Gross weight | 700 g | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Package Description | PLASTIC, DIP-6 | |
| Current Transfer Ratio-Nom | 20% | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| JESD-609 Code | e3 | |
| Pbfree Code | Yes | |
| Terminal Finish | MATTE TIN | |
| Additional Feature | UL APPROVED | |
| Reach Compliance Code | unknown | |
| Configuration | SINGLE | |
| Optoelectronic Device Type | TRANSISTOR OUTPUT OPTOCOUPLER | |
| Forward Current-Max | 0.08 A | |
| Isolation Voltage-Max | 7500 V | |
| 2nd Connector Number of Positions Loaded | LED | |
| Coll-Emtr Bkdn Voltage-Min | 300 V | |
| Length | 1m | |
| Width | 53.9mm | |
| Height | 34.4mm |
H11D1M Documents
Download datasheets and manufacturer documentation for H11D1M
- Datasheetsa5d8f37f7aa2fe960467a3d3ede03c9a.pdf
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