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ADSP-BF533SKBC600 Tech Specifications

Rochester Electronics  ADSP-BF533SKBC600 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Mounting Type Surface Mount
Package / Case 160-LFBGA, CSPBGA
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Series Blackfin®
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 160Terminations
Type Fixed Point
Terminal Finish TIN LEAD SILVER
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 160
JESD-30 Code S-PBGA-B160
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 1.32V
Supply Voltage-Min (Vsup) 0.8V
Interface SPI, SSP, UART
Clock Frequency 50MHz
Address Bus Width 20
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Voltage - I/O 1.8V 2.5V 3.3V
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Non-Volatile Memory ROM (1kB)
Voltage - Core 1.30V
On Chip Data RAM 148kB
Clock Rate 600MHz
Length 12mm
Height Seated (Max) 1.7mm
Width 12mm
RoHS Status Non-RoHS Compliant
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