RF Micro Devices Inc RF5722 Telecom Interface ICs QUAD
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RF5722 Tech Specifications
RFMD RF5722 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 8Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | RF MICRO DEVICES INC | |
| Part Package Code | QFN | |
| Package Description | 2.2 X 2.2 MM, 0.45 PITCH, GREEN, QFN-8 | |
| Moisture Sensitivity Levels | 2 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Supply Voltage-Nom | 3.3 V | |
| JESD-609 Code | e3 | |
| ECCN Code | 5A991.G | |
| Terminal Finish | MATTE TIN | |
| HTS Code | 8517.70.00.00 | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 0.65 mm | |
| Reach Compliance Code | unknown | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 8 | |
| JESD-30 Code | S-XQCC-N8 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| Seated Height-Max | 0.5 mm | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Length | 2.2 mm | |
| Width | 2.2 mm |
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