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ISL8271MAIRZ Tech Specifications
Renesas ISL8271MAIRZ technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 13 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 40-SMD Module | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tray | |
| Series | ISL8271M | |
| Published | 2013 | |
| Size / Dimension | 0.75Lx0.67W x 0.14 H 19.1mmx17.0mmx3.6mm | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Type | Non-Isolated PoL Module | |
| Terminal Finish | Matte Tin (Sn) | |
| Applications | ITE (Commercial) | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Pin Count | 40 | |
| Number of Outputs | 1Output | |
| Voltage - Input (Max) | 14V | |
| Output Voltage | 600mV | |
| Voltage - Input (Min) | 4.5V | |
| Output Current | 33A | |
| Features | Remote On/Off, OCP, OTP, OVP, UVLO | |
| RoHS Status | ROHS3 Compliant |
ISL8271MAIRZ Documents
Download datasheets and manufacturer documentation for ISL8271MAIRZ
- DatasheetsISL8271M Datasheet ISL8271MAIRZ-Renesas-datasheet-137357302.pdf ISL8271MAIRZ-Renesas-datasheet-117116802.pdf ISL8271MAIRZ-Renesas-datasheet-68801622.pdf
- PCN Assembly/OriginMult Dev Bond Wire Material Chg 24/Nov/2017
- PCN PackagingTray depth chg 03/Dec/2015
- ConflictMineralStatementRenesas-company-44.pdf
- PCN Design/SpecificationISL8271X 17/Jun/2016
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