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R5F563TEBDFB#V1 Tech Specifications

Renesas  R5F563TEBDFB#V1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Number of Pins 144Pins
Data Converters A/D 20x10b, 8x12b; D/A 2x10b
Number of I/Os 81I/Os
RAM(byte) 49152
ROM(word) 524288
Operating Temperature -40°C~85°C TA
Packaging Tray
Series RX600
Published 2016
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 144
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 2.7V
Oscillator Type Internal
Speed 100MHz
RAM Size 48K x 8
Voltage - Supply (Vcc/Vdd) 2.7V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor RX
Peripherals DMA, LVD, POR, PWM, WDT
Clock Frequency 14MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
Address Bus Width 20
EEPROM Size 32K x 8
On Chip Program ROM Width 8
External Data Bus Width 16
Length 20mm
Height Seated (Max) 1.7mm
Width 20mm
RoHS Status ROHS3 Compliant
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