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HD64F3687GHV Tech Specifications

Renesas  HD64F3687GHV technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 64-BQFP
Number of Pins 64Pins
Number of I/Os 45I/Os
Data Converters A/D 8x10b
ROM(word) 28672
Watchdog Timers Yes
Operating Temperature -20°C~75°C TA
Published 2004
Packaging Tray
Series H8® H8/300H Tiny
JESD-609 Code e6
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 64Terminations
Terminal Finish Tin/Bismuth (Sn/Bi)
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 5V
Terminal Pitch 0.8mm
Frequency 20MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number HD64F3687
Pin Count 64
Supply Voltage-Max (Vsup) 5.5V
Supply Voltage-Min (Vsup) 4V
Interface I2C, SCI
Memory Size 56kB
Oscillator Type Internal
RAM Size 4K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor H8/300H
Peripherals LVD, POR, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 56KB 56K x 8
Connectivity I2C, SCI
Bit Size 16
Access Time 20 μs
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
Number of Timers/Counters 3Timers/Counters
Length 14mm
Width 14mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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