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DF3069RF25V Tech Specifications

Renesas  DF3069RF25V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 100-BFQFP
Number of Pins 100Pins
Data Converters A/D 8x10b; D/A 2x8b
Number of I/Os 70I/Os
Operating Temperature -20°C~75°C TA
Packaging Tray
Series H8® H8/300H
Published 2006
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Frequency 25MHz
Base Part Number DF3069
Operating Supply Voltage 5V
Interface SCI
Memory Size 512kB
Oscillator Type Internal
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 4.5V~5.5V
Core Processor H8/300H
Peripherals DMA, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 512KB 512K x 8
Connectivity SCI, SmartCard
Access Time 25 μs
Number of Timers/Counters 7Timers/Counters
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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DF3069RF25V Documents

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