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HD74LV373AFP(E) Tech Specifications
Renesas HD74LV373AFP(E) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Surface Mount | YES | |
Number of Terminals | 20Terminals | |
ECCN (US) | EAR99 | |
Logic Family | LV | |
Latch Mode | Transparent | |
Number of Channels per Chip | 8Channels per Chips | |
Number of Elements per Chip | 1 | |
Number of Inputs per Chip | 8Inputs per Chips | |
Number of Input Enables per Element | 1 | |
Number of Selection Inputs per Element | 0 | |
Number of Outputs per Chip | 8Outputs per Chips | |
Number of Output Enables per Element | 1 | |
Bus Hold | No | |
Set/Reset | No | |
Maximum Propagation Delay Time @ Maximum CL (ns) | 14.9@3.3V|18@2.5V|9.2@5V | |
Absolute Propagation Delay Time (ns) | 22 | |
Process Technology | CMOS | |
Maximum Low Level Output Current (mA) | 16 | |
Maximum High Level Output Current (mA) | -16 | |
Minimum Operating Supply Voltage (V) | 2 | |
Typical Operating Supply Voltage (V) | 5|2.5|3.3 | |
Maximum Operating Supply Voltage (V) | 5.5 | |
Maximum Quiescent Current (uA) | 20 | |
Propagation Delay Test Condition (pF) | 50 | |
Minimum Operating Temperature (°C) | -40 | |
Maximum Operating Temperature (°C) | 85 | |
Standard Package Name | SOP | |
Supplier Package | SOP | |
Mounting | Surface Mount | |
Package Height | 2(Max) | |
Package Length | 12.6 | |
Package Width | 5.5 | |
PCB changed | 20 | |
Lead Shape | Gull-wing | |
Package Description | FP-20DAV | |
Package Style | SMALL OUTLINE | |
Moisture Sensitivity Levels | 1 | |
Package Body Material | PLASTIC/EPOXY | |
Operating Temperature-Min | -40 °C | |
Reflow Temperature-Max (s) | 20 | |
Operating Temperature-Max | 85 °C | |
Rohs Code | Yes | |
Manufacturer Part Number | HD74LV373AFP-E | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Package Code | SOP | |
Package Shape | RECTANGULAR | |
Manufacturer | Renesas Electronics Corporation | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Risk Rank | 5.07 | |
Part Package Code | SOIC | |
Pbfree Code | Yes | |
Part Status | NRND | |
Type | D-Type | |
HTS Code | 8542.39.00.01 | |
Technology | CMOS | |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Peak Reflow Temperature (Cel) | 260 | |
Number of Functions | 1Function | |
Terminal Pitch | 1.27 mm | |
Reach Compliance Code | compliant | |
Pin Count | 20 | |
JESD-30 Code | R-PDSO-G20 | |
Qualification Status | Not Qualified | |
Output Type | 3-State | |
Polarity | Non-Inverting | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Temperature Grade | INDUSTRIAL | |
Supply Voltage-Min (Vsup) | 2 V | |
Number of Ports | 2Ports | |
Number of Bits | 8Bits | |
Family | LV/LV-A/LVX/H | |
Output Characteristics | 3-STATE | |
Seated Height-Max | 2.2 mm | |
Output Polarity | TRUE | |
Logic IC Type | BUS DRIVER | |
Propagation Delay (tpd) | 22 ns | |
Width | 5.5 mm | |
Length | 12.6 mm | |
RoHS Status | RoHS non-compliant |
HD74LV373AFP(E) Documents
Download datasheets and manufacturer documentation for HD74LV373AFP(E)
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