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B39931B3868U410 Tech Specifications

Qualcomm  B39931B3868U410 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Aluminum
Shape Square, Fins
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Finish Blue Anodized
Series pushPIN™
Part Status Active
Type Top Mount
Attachment Method Push Pin
Height Off Base (Height of Fin) 0.984 (25.00mm)
Thermal Resistance @ Forced Air Flow 4.24°C/W @ 100 LFM
Thermal Resistance @ Natural --
Power Dissipation @ Temperature Rise --
Width 1.575 (40.00mm)
Length 1.575 (40.00mm)
Diameter --
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