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HYB18TC512160CF-3S Tech Specifications

Infineon Qimonda  HYB18TC512160CF-3S technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 84Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer QIMONDA AG
Part Package Code BGA
Package Description TFBGA, BGA84,9X15,32
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 333 MHz
Number of Words 33554432 wordsWord
Number of Words Code 32000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA84,9X15,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.28
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 84
JESD-30 Code R-PBGA-B84
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.197 mA
Organization 32MX16
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.009 A
Memory Density 536870912 bit
I/O Type COMMON
Memory IC Type DDR2 DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 12.5 mm
Width 10 mm
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HYB18TC512160CF-3S Documents

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