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HYB18T1G800CF-25F Tech Specifications

Infineon Qimonda  HYB18T1G800CF-25F technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 60Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer QIMONDA AG
Part Package Code BGA
Package Description TFBGA, BGA60,9X11,32
Access Time-Max 0.4 ns
Clock Frequency-Max (fCLK) 400 MHz
Moisture Sensitivity Levels 3
Number of Words 134217728 wordsWord
Number of Words Code 128000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 1.8 V
JESD-609 Code e1
ECCN Code EAR99
Terminal Finish TIN SILVER COPPER
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.32
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 60
JESD-30 Code R-PBGA-B60
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.9 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.7 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.212 mA
Organization 128MX8
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 8
Memory Density 1073741824 bit
I/O Type COMMON
Memory IC Type DDR2 DRAM
Refresh Cycles 8192
Sequential Burst Length 4,8
Interleaved Burst Length 4,8
Access Mode MULTI BANK PAGE BURST
Self Refresh YES
Length 13 mm
Width 9 mm
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HYB18T1G800CF-25F Documents

Download datasheets and manufacturer documentation for   HYB18T1G800CF-25F

  • Datasheets
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