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HYB18H256321BF-12 Tech Specifications

Infineon Qimonda  HYB18H256321BF-12 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 136Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer QIMONDA AG
Part Package Code BGA
Package Description TFBGA, BGA136,12X17,32
Access Time-Max 0.22 ns
Clock Frequency-Max (fCLK) 800 MHz
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Operating Temperature-Max 85 °C
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA136,12X17,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Supply Voltage-Nom (Vsup) 2 V
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.24
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
Pin Count 136
JESD-30 Code R-PBGA-B136
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.1 V
Temperature Grade OTHER
Supply Voltage-Min (Vsup) 1.9 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Supply Current-Max 0.685 mA
Organization 8MX32
Output Characteristics 3-STATE
Seated Height-Max 1.2 mm
Memory Width 32
Standby Current-Max 0.305 A
Memory Density 268435456 bit
I/O Type COMMON
Memory IC Type SYNCHRONOUS GRAPHICS RAM MODULE
Refresh Cycles 4096
Sequential Burst Length 4,8
Access Mode FOUR BANK PAGE BURST
Self Refresh YES
Length 14 mm
Width 10 mm
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