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LQA30B200C Tech Specifications

Power Integrations  LQA30B200C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Tape & Reel (TR)
Series Qspeed™
Published 2013
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 2Terminations
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Applications EFFICIENCY
HTS Code 8541.10.00.80
Max Power Dissipation 56.8W
Terminal Position SINGLE
Terminal Form GULL WING
JESD-30 Code R-PSSO-G2
Element Configuration Common Cathode
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 500μA @ 200V
Voltage - Forward (Vf) (Max) @ If 1.2V @ 15A
Forward Current 30A
Max Reverse Leakage Current 350A
Operating Temperature - Junction -55°C~150°C
Max Surge Current 130A
Max Reverse Voltage (DC) 200V
Average Rectified Current 15A
Number of Phases 1Phase
Reverse Recovery Time 16.5 ns
Max Repetitive Reverse Voltage (Vrrm) 200V
Peak Non-Repetitive Surge Current 350A
Diode Configuration 1 Pair Common Cathode
Recovery Time 16.5 ns
Radiation Hardening No
RoHS Status RoHS Compliant
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LQA30B200C Documents

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