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PEX8111-BB66FBCF Tech Specifications

PLX Technology  PEX8111-BB66FBCF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Surface Mount YES
Number of Terminals 161Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer PLX TECHNOLOGY INC
Part Package Code BGA
Package Description LFBGA,
Clock Frequency-Max 66 MHz
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Max 1.6 V
Supply Voltage-Min 1.4 V
Supply Voltage-Nom 1.5 V
ECCN Code 3A991.A.2
Additional Feature ALSO REQUIRES AT 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 0.65 mm
Reach Compliance Code unknown
Pin Count 161
JESD-30 Code S-PBGA-B161
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, PCI
Seated Height-Max 1.53 mm
Address Bus Width 32
External Data Bus Width 32
Length 10 mm
Width 10 mm
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PEX8111-BB66FBCF Documents

Download datasheets and manufacturer documentation for   PEX8111-BB66FBCF

  • Datasheets
PEX8111-BB66FBCF brand manufacturers: PLX Technology, Twicea stock, PEX8111-BB66FBCF reference price.PLX Technology. PEX8111-BB66FBCF parameters, PEX8111-BB66FBCF Datasheet PDF and pin diagram description download.You can use the PEX8111-BB66FBCF Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find PEX8111-BB66FBCF pin diagram and circuit diagram and usage method of function,PEX8111-BB66FBCF electronics tutorials.You can download from the Twicea.