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1953729 Tech Specifications
Phoenix Contact 1953729 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 7 Weeks | |
| Mount | Through Hole | |
| Mounting Type | Through Hole | |
| Housing Material | Liquid Crystal Polymer (LCP) | |
| Weight | 102.999998g | |
| Contact Materials | Copper | |
| Current-IEC | 8A per Position | |
| Voltage-IEC | 250V | |
| Voltage Rated | 160V | |
| Packaging | Bulk | |
| Series | COMBICON MCDN | |
| Published | 2002 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Connector Type | Plug | |
| Type | Header, Male Pins, Shrouded (4 Side) | |
| Number of Positions | 6Positions | |
| Color | Black | |
| Number of Rows | 1Row | |
| Additional Feature | LCP, UL 94V-0 | |
| Pitch | 0.138 3.50mm | |
| Orientation | Right Angle | |
| Depth | 13.3mm | |
| Insulation Height | 0.598 15.19mm | |
| Current Rating | 8A | |
| Termination Style | Solder | |
| Voltage | 150V | |
| Contact Tail Length | 0.102 2.60mm | |
| Max Current Rating | 8A | |
| Number of Levels | 2Levels | |
| Current | 8A | |
| Contact Mating Finish | Tin | |
| Number of Decks | 1Deck | |
| Number of Ways | 3Ways | |
| Safety Approval | UL | |
| Header Orientation | 90°, Right Angle | |
| Number of Positions Per Level | 3Positions Per Levels | |
| Fastening Method | CONNECTOR | |
| Height | 13.3mm | |
| Length | 12mm | |
| Width | 17.8mm | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant | |
| Flammability Rating | UL94 V-0 | |
| Lead Free | Lead Free |
1953729 Documents
Download datasheets and manufacturer documentation for 1953729
- Datasheets1953729 Datasheet 3-G1-3.5-P26THR-Phoenix-Contact-datasheet-8820512.pdf MCDN-1,5-3-G1-3.5-P26THR-Phoenix-Contact-datasheet-66579415.pdf 1953729-Phoenix-Contact-datasheet-33527310.pdf 1953729-Phoenix-Contact-datasheet-115548188.pdf MINI COMBICON Double-Level Headers
- PCN PackagingMultiple Devices Packaging 16/Apr/2019
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