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TH997-288-192-2.0 Tech Specifications

Microchip  TH997-288-192-2.0 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Material Silicone
Shape Rectangular
Series TH997
Packaging Sheet
Part Status Active
Type Gap Filler Pad, Sheet
Color Blue
Usage Thermally Conductive
Adhesive Tacky - Both Sides
Storage/Refrigeration Temperature 68°F ~ 86°F (20°C ~ 30°C)
Outline 288.00mm x 192.00mm
Thermal Conductivity 2.4W/m-K
Thickness 0.0790" (2.000mm)
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TH997-288-192-2.0 brand manufacturers: Penchem Technologies Sdn Bhd, Twicea stock, TH997-288-192-2.0 reference price.Penchem Technologies Sdn Bhd. TH997-288-192-2.0 parameters, TH997-288-192-2.0 Datasheet PDF and pin diagram description download.You can use the TH997-288-192-2.0 Thermal - Pads, Sheets, DSP Datesheet PDF, find TH997-288-192-2.0 pin diagram and circuit diagram and usage method of function,TH997-288-192-2.0 electronics tutorials.You can download from the Twicea.