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ECC-T3F330JG2 Tech Specifications

Panasonic  ECC-T3F330JG2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount, MLCC
Package / Case Nonstandard SMD
Terminal Shape WRAPAROUND
Operating Temperature -25°C~105°C
Packaging Tape & Reel (TR)
Series ECC
Published 2008
Size / Dimension 0.224Lx0.177W 5.70mmx4.50mm
Tolerance ±5%
JESD-609 Code e2
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Temperature Coefficient SL/GP
Composition Ceramic
Applications General Purpose
HTS Code 8532.23.00.20
Capacitance 33pF
Voltage - Rated DC 3kV
Packing Method TR, EMBOSSED, 13 INCH
Depth 4.5mm
Temperature Characteristics Code SL
Multilayer No
Rated (DC) Voltage (URdc) 3000V
Size Code 2218
Features High Voltage
Height 2.3mm
Length 5.7mm
Thickness (Max) 0.091 2.30mm
Thickness 2.3114mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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