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DB4X501K0R Tech Specifications

Panasonic  DB4X501K0R technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-61AB
Number of Pins 4Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Tape & Reel (TR)
Published 2010
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4Terminations
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number DB4X501
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 200μA @ 50V
Voltage - Forward (Vf) (Max) @ If 550mV @ 200mA
Forward Current 150mA
Max Reverse Leakage Current 200μA
Operating Temperature - Junction 125°C Max
Forward Voltage 550mV
Max Reverse Voltage (DC) 50V
Average Rectified Current 200mA
Reverse Recovery Time 1.6 ns
Peak Reverse Current 200μA
Max Repetitive Reverse Voltage (Vrrm) 50V
JEDEC-95 Code TO-253AA
Peak Non-Repetitive Surge Current 750mA
Diode Configuration 2 Independent
Max Forward Surge Current (Ifsm) 750mA
Recovery Time 1.6 ns
Frequency Band ULTRA HIGH FREQUENCY
Height 1.1mm
Length 2.9mm
Width 1.5mm
REACH SVHC No SVHC
RoHS Status RoHS Compliant
Lead Free Lead Free
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DB4X501K0R Documents

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