DB3X313F0L Tech Specifications

Panasonic  DB3X313F0L technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 2 Elements
Packaging Cut Tape (CT)
Published 1997
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -55°C
HTS Code 8541.10.00.60
Terminal Position DUAL
Terminal Form GULL WING
Base Part Number DB3X313
Element Configuration Single
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 50μA @ 30V
Voltage - Forward (Vf) (Max) @ If 550mV @ 200mA
Forward Current 200mA
Operating Temperature - Junction 125°C Max
Output Current-Max 0.2A
Forward Voltage 550mV
Max Reverse Voltage (DC) 30V
Average Rectified Current 200mA
Reverse Recovery Time 1.5 ns
Peak Reverse Current 50μA
Max Repetitive Reverse Voltage (Vrrm) 30V
Peak Non-Repetitive Surge Current 1A
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 1A
Frequency Band ULTRA HIGH FREQUENCY
Height 1.1mm
Length 2.9mm
Width 1.5mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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