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SMMBT5551LT1G Tech Specifications
ON Semiconductor SMMBT5551LT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | ACTIVE (Last Updated: 3 days ago) | |
Factory Lead Time | 4 Weeks | |
Contact Plating | Tin | |
Mounting Type | Surface Mount | |
Package / Case | TO-236-3, SC-59, SOT-23-3 | |
Surface Mount | YES | |
Number of Pins | 3Pins | |
Transistor Element Material | SILICON | |
Collector-Emitter Breakdown Voltage | 160V | |
Current-Collector (Ic) (Max) | 600mA | |
Number of Elements | 1 Element | |
hFEMin | 80 | |
Operating Temperature | -55°C~150°C TJ | |
Packaging | Tape & Reel (TR) | |
Published | 2001 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 3Terminations | |
ECCN Code | EAR99 | |
Max Power Dissipation | 225mW | |
Terminal Position | DUAL | |
Terminal Form | GULL WING | |
Base Part Number | MMBT5551 | |
Pin Count | 3 | |
Element Configuration | Single | |
Power Dissipation | 300mW | |
Transistor Application | SWITCHING | |
Polarity/Channel Type | N-CHANNEL | |
Transistor Type | NPN | |
Collector Emitter Voltage (VCEO) | 160V | |
Max Collector Current | 60mA | |
DC Current Gain (hFE) (Min) @ Ic, Vce | 80 @ 10mA 5V | |
Current - Collector Cutoff (Max) | 100nA | |
Vce Saturation (Max) @ Ib, Ic | 200mV @ 5mA, 50mA | |
Max Breakdown Voltage | 160V | |
Collector Base Voltage (VCBO) | 180V | |
Emitter Base Voltage (VEBO) | 6V | |
VCEsat-Max | 0.2 V | |
Height | 1.11mm | |
Length | 3.04mm | |
Width | 2.64mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
SMMBT5551LT1G Documents
Download datasheets and manufacturer documentation for SMMBT5551LT1G
- DatasheetsMMBT5550L-51L, SMMBT5551L SMMBT5551LT1G-ON-Semiconductor-datasheet-638786.pdf SMMBT5551LT1G-ON-Semiconductor-datasheet-11752832.pdf
- Environmental InformationMaterial Declaration SMMBT5551LT1G
- PCN Design/SpecificationPd-Coated Cu Wire Update 23/Sep/2015 SOT23 27/Sep/2016
- PCN Assembly/OriginMult Dev Mold Comp Chg 16/Nov/2019
- ReachStatementON-Semiconductor-company-79.pdf
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