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NTZD3158PT1G Tech Specifications
ON Semiconductor NTZD3158PT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Factory Lead Time | 2 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-563, SOT-666 | |
| Operating Temperature (Max.) | 150°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2016 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Max Power Dissipation | 250mW | |
| Operating Mode | ENHANCEMENT MODE | |
| Power - Max | 250mW | |
| FET Type | 2 P-Channel (Dual) | |
| Rds On (Max) @ Id, Vgs | 900m Ω @ 430mA, 4.5V | |
| Vgs(th) (Max) @ Id | 1V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 175pF @ 16V | |
| Gate Charge (Qg) (Max) @ Vgs | 2.5nC @ 4.5V | |
| Drain to Source Voltage (Vdss) | 20V | |
| Continuous Drain Current (ID) | 430mA | |
| Drain Current-Max (Abs) (ID) | 0.43A | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| FET Feature | Standard | |
| RoHS Status | ROHS3 Compliant |
NTZD3158PT1G Documents
Download datasheets and manufacturer documentation for NTZD3158PT1G
- PCN PackagingCovering Tape/Material Chg 20/May/2016
- ReachStatementON-Semiconductor-company-79.pdf
- Environmental InformationMaterial Declaration NTZD3158PT1G
- Datasheets
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