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- NSBC114YDXV6T1G
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NSBC114YDXV6T1G Tech Specifications
ON Semiconductor NSBC114YDXV6T1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
Factory Lead Time | 2 Weeks | |
Contact Plating | Tin | |
Mounting Type | Surface Mount | |
Package / Case | SOT-563, SOT-666 | |
Surface Mount | YES | |
Number of Pins | 6Pins | |
Collector-Emitter Breakdown Voltage | 50V | |
Number of Elements | 2 Elements | |
hFEMin | 80 | |
Packaging | Tape & Reel (TR) | |
Published | 2006 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 6Terminations | |
ECCN Code | EAR99 | |
Max Operating Temperature | 150°C | |
Min Operating Temperature | -55°C | |
Additional Feature | BUILT IN BIAS RESISTOR RATIO 4.7 | |
Voltage - Rated DC | 50V | |
Max Power Dissipation | 500mW | |
Terminal Form | FLAT | |
Peak Reflow Temperature (Cel) | 260 | |
Current Rating | 100mA | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Base Part Number | NSBC1* | |
Pin Count | 6 | |
Polarity | NPN | |
Element Configuration | Dual | |
Power Dissipation | 357mW | |
Transistor Application | SWITCHING | |
Transistor Type | 2 NPN - Pre-Biased (Dual) | |
Collector Emitter Voltage (VCEO) | 50V | |
Max Collector Current | 100mA | |
DC Current Gain (hFE) (Min) @ Ic, Vce | 80 @ 5mA 10V | |
Current - Collector Cutoff (Max) | 500nA | |
Vce Saturation (Max) @ Ib, Ic | 250mV @ 300μA, 10mA | |
Max Breakdown Voltage | 50V | |
Resistor - Base (R1) | 10k Ω | |
Continuous Collector Current | 100mA | |
Resistor - Emitter Base (R2) | 47k Ω | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
NSBC114YDXV6T1G Documents
Download datasheets and manufacturer documentation for NSBC114YDXV6T1G
- DatasheetsMUN5214DW1, NSBC114YDxx
- Environmental InformationMaterial Declaration NSBC114YDXV6T1G
- PCN Design/SpecificationWire Bond 01/Dec/2010
- PCN Assembly/OriginWafer Source Addition 26/Nov/2014
- PCN PackagingCarrier Tape 15/Aug/2017 Mult Devices 27/Oct/2017
- ReachStatementON-Semiconductor-company-79.pdf
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