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- NC7SZ57L6X
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NC7SZ57L6X Tech Specifications
ON Semiconductor NC7SZ57L6X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
| Factory Lead Time | 13 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 6-UFDFN | |
| Number of Pins | 6Pins | |
| Weight | 30g | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Series | 7SZ | |
| Published | 2008 | |
| JESD-609 Code | e4 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Packing Method | TAPE AND REEL | |
| Voltage - Supply | 1.65V~5.5V | |
| Terminal Position | BOTTOM | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 2.3V | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Base Part Number | 7SZ57 | |
| Output Type | Single-Ended | |
| Supply Voltage-Max (Vsup) | 5.5V | |
| Load Capacitance | 50pF | |
| Propagation Delay | 6 ns | |
| Quiescent Current | 1μA | |
| Turn On Delay Time | 14.5 ns | |
| Family | LVC/LCX/Z | |
| Logic Function | Multi Function | |
| Number of Inputs | 3Inputs | |
| Logic Type | Configurable Multiple Function | |
| Max I(ol) | 0.024 A | |
| Number of Gates | 1Gate | |
| Schmitt Trigger Input | No | |
| Height | 500μm | |
| Length | 1.45mm | |
| Width | 1mm | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
NC7SZ57L6X Documents
Download datasheets and manufacturer documentation for NC7SZ57L6X
- PCN Assembly/OriginMult Dev Assem/DS Chg 9/Jan/2019
- DatasheetsNC7SZ57L6X-ON-Semiconductor-datasheet-136532923.pdf NC7SZ57L6X-ON-Semiconductor-datasheet-86698237.pdf NC7SZ57-58 NC7SZ57L6X-Fairchild-datasheet-65320.pdf NC7SZ57L6X-ON-Semiconductor-datasheet-12549112.pdf
- PCN Design/SpecificationDie Material, Mold Compound 03/Oct/2008 Marking Content 19/Nov/2013
- ReachStatementFairchild-Semiconductor-NC7SZ57L6X.pdf
- Environmental InformationMaterial Declaration NC7SZ57L6X
- PCN PackagingMult Devices 24/Oct/2017
- TechnicalDrawingFairchild-Semiconductor-NC7SZ57L6X.pdf
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