ON Semiconductor MPC860ENZQ50D4 Embedded Microprocessors 50 MHz
MPC860ENZQ50D4
1807-490-MPC860ENZQ50D4
RoHS Compliant
uPs/uCs/Peripheral ICs Type: MICROPROCESSOR, RISC
In Stock Min. : 1
Mult. : 1
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MPC860ENZQ50D4 Tech Specifications
ON Semiconductor MPC860ENZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Surface Mount | YES | |
| Number of Terminals | 357Terminals | |
| Package Description | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
| Package Style | GRID ARRAY | |
| Moisture Sensitivity Levels | 3 | |
| Package Body Material | PLASTIC/EPOXY | |
| Supply Voltage-Nom | 3.3 V | |
| Reflow Temperature-Max (s) | 30 | |
| Supply Voltage-Min | 3.135 V | |
| Rohs Code | No | |
| Manufacturer Part Number | MPC860ENZQ50D4 | |
| Clock Frequency-Max | 50 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Rochester Electronics LLC | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Supply Voltage-Max | 3.465 V | |
| Risk Rank | 5.39 | |
| Part Package Code | BGA | |
| JESD-609 Code | e0 | |
| Pbfree Code | No | |
| Terminal Finish | TIN LEAD | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 245 | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 357 | |
| JESD-30 Code | S-PBGA-B357 | |
| Qualification Status | COMMERCIAL | |
| Speed | 50 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Seated Height-Max | 2.52 mm | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Width | 25 mm | |
| Length | 25 mm |
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