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MOCD223M Tech Specifications

ON Semiconductor  MOCD223M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 8 hours ago)
Factory Lead Time 6 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8Pins
Weight 252mg
Current Transfer Ratio-Min 500% @ 1mA
Number of Elements 2 Elements
Turn Off Delay Time 55 μs
Operating Temperature -40°C~100°C
Packaging Tube
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Additional Feature UL RECOGNIZED
Max Power Dissipation 250mW
Voltage - Isolation 2500Vrms
Output Voltage 30V
Output Type Darlington
Power Dissipation 240mW
Voltage - Forward (Vf) (Typ) 1.25V
Input Type DC
Turn On Delay Time 10 μs
Forward Current 1mA
Max Output Voltage 30V
Output Current per Channel 150mA
Rise Time 3.5μs
Fall Time (Typ) 110 μs
Collector Emitter Voltage (VCEO) 30V
Max Collector Current 150mA
Rise / Fall Time (Typ) 8μs 110μs
Reverse Breakdown Voltage 6V
Reverse Voltage 6V
Forward Voltage-Max 1.3V
Max Input Current 60mA
Current - DC Forward (If) (Max) 60mA
Input Current 1mA
Turn On / Turn Off Time (Typ) 10μs, 125μs
Max Junction Temperature (Tj) 125°C
Reverse Voltage (DC) 6V
Ambient Temperature Range High 100°C
Current Transfer Ratio 1000 %
Dark Current-Max 50nA
Test Voltage 3kV
Height 3.63mm
Width 6.1mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MOCD223M Documents

Download datasheets and manufacturer documentation for   MOCD223M

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