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MMSZ5252BT1G Tech Specifications

ON Semiconductor  MMSZ5252BT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Factory Lead Time 8 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SOD-123
Number of Pins 2Pins
Material Plastic
Breakdown Voltage / V 27V
Number of Elements 1 Element
Operating Temperature -55°C~150°C
Packaging Cut Tape (CT)
Published 2005
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
HTS Code 8541.10.00.50
Power Rating 500mW
Voltage - Rated DC 24V
Max Power Dissipation 500mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MMSZ5252B
Pin Count 2
Working Voltage 24V
Polarity UNIDIRECTIONAL
Impedance 33Ohm
Element Configuration Single
Diode Type ZENER DIODE
Current - Reverse Leakage @ Vr 100nA @ 18V
Power Dissipation 500mW
Voltage - Forward (Vf) (Max) @ If 900mV @ 10mA
Max Reverse Leakage Current 100nA
Impedance-Max 33Ohm
Test Current 5.2mA
Reference Voltage 24V
Forward Voltage 900mV
Zener Voltage 24V
Voltage Tol-Max 5%
Peak Reverse Current 100nA
Voltage Tolerance 5%
ESD Protection Yes
Zener Current 10mA
Height 1.12mm
Length 2.69mm
Width 1.6mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MMSZ5252BT1G Documents

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