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MMSZ5226BT1G Tech Specifications

ON Semiconductor  MMSZ5226BT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 5 hours ago)
Factory Lead Time 8 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case SOD-123
Surface Mount YES
Number of Pins 2Pins
Material Plastic
Breakdown Voltage / V 3.47V
Number of Elements 1 Element
Operating Temperature -55°C~150°C
Packaging Tape & Reel (TR)
Published 2006
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
HTS Code 8541.10.00.50
Power Rating 500mW
Voltage - Rated DC 3.3V
Max Power Dissipation 500mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MMSZ5226B
Pin Count 2
Working Voltage 3.3V
Polarity UNIDIRECTIONAL
Configuration SINGLE
Impedance 28Ohm
Diode Type ZENER DIODE
Current - Reverse Leakage @ Vr 25μA @ 1V
Power Dissipation 500mW
Voltage - Forward (Vf) (Max) @ If 900mV @ 10mA
Max Reverse Leakage Current 25μA
Impedance-Max 28Ohm
Test Current 20mA
Reference Voltage 3.3V
Forward Voltage 900mV
Zener Voltage 3.3V
Voltage Tol-Max 5%
Peak Reverse Current 25μA
Voltage Tolerance 5%
ESD Protection Yes
Zener Current 10mA
Height 1.12mm
Length 2.69mm
Width 1.6mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MMSZ5226BT1G Documents

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