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MM3Z8V2B Tech Specifications
ON Semiconductor MM3Z8V2B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
| Factory Lead Time | 18 Weeks | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SC-90, SOD-323F | |
| Number of Pins | 2Pins | |
| Weight | 27.6mg | |
| Diode Element Material | SILICON | |
| Number of Elements | 1 Element | |
| Operating Temperature | -65°C~150°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2010 | |
| Tolerance | ±2% | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 2Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| HTS Code | 8541.10.00.50 | |
| Max Power Dissipation | 200mW | |
| Terminal Position | DUAL | |
| Terminal Form | FLAT | |
| Base Part Number | MM3Z8V2 | |
| Working Voltage | 8.2V | |
| Polarity | UNIDIRECTIONAL | |
| Impedance | 14Ohm | |
| Element Configuration | Single | |
| Diode Type | ZENER DIODE | |
| Current - Reverse Leakage @ Vr | 630nA @ 5V | |
| Power Dissipation | 200mW | |
| Voltage - Forward (Vf) (Max) @ If | 1V @ 10mA | |
| Max Reverse Leakage Current | 630nA | |
| Impedance-Max | 14Ohm | |
| Test Current | 5mA | |
| Reference Voltage | 8.2V | |
| Forward Voltage | 1V | |
| Zener Voltage | 8.2V | |
| Voltage Tol-Max | 2% | |
| Peak Reverse Current | 630nA | |
| Voltage Tolerance | 2% | |
| Height | 1mm | |
| Length | 1.3mm | |
| Width | 1.7mm | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
MM3Z8V2B Documents
Download datasheets and manufacturer documentation for MM3Z8V2B
- DatasheetsMM3Z2V4B-MM3Z75VB MM3Z8V2B-ON-Semiconductor-datasheet-85575434.pdf MM3Z8V2B-ON-Semiconductor-datasheet-101150021.pdf MM3Z8V2B-ON-Semiconductor-datasheet-11548057.pdf MM3Z8V2B-Fairchild-datasheet-166051.pdf
- PCN Design/SpecificationSOD323F Material 16/Apr/2013 Logo 17/Aug/2017
- Environmental InformationMaterial Declaration MM3Z8V2B
- ReachStatementFairchild-Semiconductor-MM3Z8V2B.pdf
- PCN PackagingMult Devices 24/Oct/2017
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