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MBRB8H100T4G Tech Specifications

ON Semiconductor  MBRB8H100T4G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 5 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Series SWITCHMODE™
Published 2008
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Max Operating Temperature 175°C
Min Operating Temperature -65°C
Applications POWER
HTS Code 8541.10.00.80
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MBRB8H100
Pin Count 3
JESD-30 Code R-PSSO-G2
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 4.5μA @ 100V
Voltage - Forward (Vf) (Max) @ If 710mV @ 8A
Case Connection CATHODE
Forward Current 8A
Max Reverse Leakage Current 4.5μA
Operating Temperature - Junction -65°C~175°C
Max Surge Current 250A
Output Current-Max 8A
Halogen Free Halogen Free
Forward Voltage 710mV
Max Reverse Voltage (DC) 100V
Average Rectified Current 8A
Number of Phases 1Phase
Peak Reverse Current 4.5μA
Max Repetitive Reverse Voltage (Vrrm) 100V
Capacitance @ Vr, F 600pF @ 4V 1MHz
Peak Non-Repetitive Surge Current 250A
Max Forward Surge Current (Ifsm) 250A
Height 4.83mm
Length 10.29mm
Width 9.65mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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