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MBR230LSFT1G Tech Specifications

ON Semiconductor  MBR230LSFT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 9 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case SOD-123F
Surface Mount YES
Number of Pins 2Pins
Diode Element Material SILICON
Number of Elements 1 Element
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2Terminations
ECCN Code EAR99
Max Operating Temperature 125°C
Min Operating Temperature -55°C
Applications GENERAL PURPOSE
Additional Feature FREE WHEELING DIODE
HTS Code 8541.10.00.80
Terminal Position DUAL
Terminal Form FLAT
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MBR230
Pin Count 2
Element Configuration Single
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 1mA @ 30V
Voltage - Forward (Vf) (Max) @ If 430mV @ 2A
Forward Current 2A
Operating Temperature - Junction -55°C~125°C
Output Current-Max 2A
Halogen Free Halogen Free
Forward Voltage 430mV
Max Reverse Voltage (DC) 30V
Average Rectified Current 2A
Number of Phases 1Phase
Peak Reverse Current 1mA
Max Repetitive Reverse Voltage (Vrrm) 30V
Peak Non-Repetitive Surge Current 40A
Max Forward Surge Current (Ifsm) 40A
Height 900μm
Length 2.9mm
Width 1.8mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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MBR230LSFT1G Documents

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