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H11L1SR2M Tech Specifications

ON Semiconductor  H11L1SR2M technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Factory Lead Time 5 Weeks
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-SMD, Gull Wing
Number of Pins 6Pins
Weight 810mg
Number of Elements 1 Element
Turn Off Delay Time 1.2 μs
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2008
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Additional Feature UL RECOGNIZED
Max Power Dissipation 250mW
Voltage - Supply 3V~15V
Supply Voltage 16V
Frequency 1MHz
Voltage - Isolation 4170Vrms
Output Voltage 16V
Output Type Open Collector
Max Output Current 50mA
Configuration SINGLE
Power Dissipation 250mW
Output Current 50mA
Voltage - Forward (Vf) (Typ) 1.2V
Propagation Delay 4 μs
Input Type DC
Turn On Delay Time 1 μs
Optoelectronic Device Type LOGIC IC OUTPUT OPTOCOUPLER
Forward Current 10mA
Max Output Voltage 16V
Data Rate 1 MBps
Direction Unidirectional
Output Current per Channel 50mA
Rise Time 100ns
Fall Time (Typ) 100 ns
Max Collector Current 5mA
Rise / Fall Time (Typ) 100ns 100ns
Reverse Breakdown Voltage 6V
Reverse Voltage 6V
Current - DC Forward (If) (Max) 30mA
Input Current 10mA
On-State Current-Max 0.05A
Propagation Delay tpLH / tpHL (Max) 4μs, 4μs
Inputs - Side 1/Side 2 1/0
Max Junction Temperature (Tj) 125°C
Reverse Voltage (DC) 6V
Hysteresis Ratio-Nom 0.75
Height 4.8mm
Length 8.89mm
Width 8.51mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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H11L1SR2M Documents

Download datasheets and manufacturer documentation for   H11L1SR2M

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