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FPAB30BH60B Tech Specifications

ON Semiconductor  FPAB30BH60B technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 8 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case 27-PowerDIP Module (1.205, 30.60mm)
Number of Pins 27Pins
Weight 21.39g
Series PFC SPM® 3
Published 2013
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 27Terminations
ECCN Code EAR99
Type IGBT
Terminal Finish Tin (Sn)
Max Operating Temperature 150°C
Min Operating Temperature -40°C
HTS Code 8541.29.00.95
Max Power Dissipation 104W
Terminal Position ZIG-ZAG
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Supply Voltage 15V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Voltage - Isolation 2500Vrms
Supply Voltage-Max (Vsup) 16.5V
Power Supplies 15V
Supply Voltage-Min (Vsup) 13.5V
Configuration 1 Phase
Current 30A
Power Dissipation 104W
Topology Boost
Collector Emitter Voltage (VCEO) 2.8V
Max Collector Current 60A
Max Breakdown Voltage 600V
Height 5.5mm
Length 44mm
Width 26.8mm
RoHS Status ROHS3 Compliant
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FPAB30BH60B Documents

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