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FIN1101K8X Tech Specifications
ON Semiconductor FIN1101K8X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 6 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-VFSOP (0.091, 2.30mm Width) | |
| Number of Pins | 8Pins | |
| Weight | 30mg | |
| Interface Standards | EIA-644-A; TIA-644-A | |
| Number of Elements | 1 Element | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2002 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 8Terminations | |
| ECCN Code | EAR99 | |
| Type | Buffer, ReDriver | |
| Applications | LVDS | |
| Voltage - Supply | 3V~3.6V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | FIN1101 | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 3.3V | |
| Operating Supply Current | 9.3mA | |
| Nominal Supply Current | 13.5mA | |
| Max Supply Current | 13.5mA | |
| Propagation Delay | 1.75 ns | |
| Turn On Delay Time | 1.75 ns | |
| Max Output Voltage | 450mV | |
| Differential Output | YES | |
| Input | LVDS, LVPECL | |
| Driver Number of Bits | 1Bit | |
| Max Input Current | 20μA | |
| Receiver Number of Bits | 1Bit | |
| Data Rate (Max) | 1.6Gbps | |
| Delay Time | 1.1ns | |
| Capacitance - Input | 2.2pF | |
| Height | 700μm | |
| Length | 2.3mm | |
| Width | 2mm | |
| REACH SVHC | No SVHC | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FIN1101K8X Documents
Download datasheets and manufacturer documentation for FIN1101K8X
- DatasheetsFIN1101
- Environmental InformationMaterial Declaration FIN1101K8X
- PCN Design/SpecificationMold Compound 27/Aug/2008 Logo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
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