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FDS8984 Tech Specifications
ON Semiconductor FDS8984 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | ACTIVE (Last Updated: 1 week ago) | |
Factory Lead Time | 10 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 8-SOIC (0.154, 3.90mm Width) | |
Contact Plating | Tin | |
Number of Pins | 8Pins | |
Weight | 187mg | |
Transistor Element Material | SILICON | |
Number of Elements | 2 Elements | |
Turn Off Delay Time | 42 ns | |
Operating Temperature | -55°C~150°C TJ | |
Packaging | Tape & Reel (TR) | |
Series | PowerTrench® | |
Published | 2001 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 8Terminations | |
ECCN Code | EAR99 | |
Resistance | 23MOhm | |
Voltage - Rated DC | 30V | |
Max Power Dissipation | 1.6W | |
Terminal Form | GULL WING | |
Current Rating | 7A | |
Element Configuration | Dual | |
Operating Mode | ENHANCEMENT MODE | |
Power Dissipation | 1.6W | |
Turn On Delay Time | 5 ns | |
FET Type | 2 N-Channel (Dual) | |
Transistor Application | SWITCHING | |
Rds On (Max) @ Id, Vgs | 23m Ω @ 7A, 10V | |
Vgs(th) (Max) @ Id | 2.5V @ 250μA | |
Input Capacitance (Ciss) (Max) @ Vds | 635pF @ 15V | |
Gate Charge (Qg) (Max) @ Vgs | 13nC @ 10V | |
Rise Time | 9ns | |
Fall Time (Typ) | 9 ns | |
Continuous Drain Current (ID) | 7mA | |
Threshold Voltage | 1.7V | |
Gate to Source Voltage (Vgs) | 20V | |
Drain Current-Max (Abs) (ID) | 7A | |
Drain to Source Breakdown Voltage | 30V | |
Pulsed Drain Current-Max (IDM) | 30A | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
FET Feature | Logic Level Gate | |
Nominal Vgs | 1.7 V | |
Length | 5mm | |
Height | 1.5mm | |
Width | 4mm | |
REACH SVHC | No SVHC | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
FDS8984 Documents
Download datasheets and manufacturer documentation for FDS8984
- DatasheetsFDS8984
- Environmental InformationMaterial Declaration FDS8984
- PCN Design/SpecificationMold Compound 12/Dec/2007 Logo 17/Aug/2017
- PCN Assembly/OriginMult Dev Sourcing Rev 10/Dec/2018
- PCN PackagingMult Devices 24/Oct/2017 Mult MSL1 Pkg Chg 20/Dec/2018
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