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FDME1023PZT Tech Specifications

ON Semiconductor  FDME1023PZT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Factory Lead Time 16 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 6-UFDFN Exposed Pad
Number of Pins 6Pins
Weight 25.2mg
Transistor Element Material SILICON
Number of Elements 2 Elements
Turn Off Delay Time 33 ns
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Series PowerTrench®
Published 2009
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6Terminations
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature ESD PROTECTION
Max Power Dissipation 1.4W
Element Configuration Dual
Operating Mode ENHANCEMENT MODE
Power Dissipation 1.3W
Case Connection DRAIN
Turn On Delay Time 4.7 ns
Power - Max 600mW
FET Type 2 P-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 142m Ω @ 2.3A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 405pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 7.7nC @ 4.5V
Rise Time 4.8ns
Drain to Source Voltage (Vdss) 20V
Fall Time (Typ) 16 ns
Continuous Drain Current (ID) 2.6A
Threshold Voltage -600mV
Gate to Source Voltage (Vgs) 8V
Drain to Source Breakdown Voltage -20V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Nominal Vgs -600 mV
Feedback Cap-Max (Crss) 75 pF
Width 1.6mm
Length 1.6mm
Height 500μm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
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FDME1023PZT Documents

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