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FDC5614P Tech Specifications
ON Semiconductor FDC5614P technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 5 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | |
| Number of Pins | 6Pins | |
| Transistor Element Material | SILICON | |
| Current - Continuous Drain (Id) @ 25℃ | 3A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V 10V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 1.6W Ta | |
| Turn Off Delay Time | 19 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| Published | 2002 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| ECCN Code | EAR99 | |
| Resistance | 105MOhm | |
| Voltage - Rated DC | -60V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Current Rating | -3A | |
| Number of Channels | 1Channel | |
| Voltage | 60V | |
| Element Configuration | Single | |
| Current | 2A | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 1.6W | |
| Turn On Delay Time | 7 ns | |
| FET Type | P-Channel | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 105m Ω @ 3A, 10V | |
| Vgs(th) (Max) @ Id | 3V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 759pF @ 30V | |
| Gate Charge (Qg) (Max) @ Vgs | 24nC @ 10V | |
| Rise Time | 10ns | |
| Vgs (Max) | ±20V | |
| Fall Time (Typ) | 10 ns | |
| Continuous Drain Current (ID) | 3A | |
| Threshold Voltage | -1.6V | |
| Gate to Source Voltage (Vgs) | 20V | |
| Drain to Source Breakdown Voltage | -60V | |
| Max Junction Temperature (Tj) | 150°C | |
| Nominal Vgs | -1.6 V | |
| Height | 900μm | |
| Length | 3mm | |
| Width | 1.7mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
FDC5614P Documents
Download datasheets and manufacturer documentation for FDC5614P
- PCN Assembly/OriginKorea Fab Site Add 3/Jan/2017
- PCN Design/SpecificationMold Compound 08/April/2008 Logo 17/Aug/2017
- DatasheetsFDC5614P-ON-Semiconductor-datasheet-86686968.pdf FDC5614P-ON-Semiconductor-datasheet-67321132.pdf FDC5614P.-Fairchild-Semiconductor-datasheet-47575546.pdf FDC5614P-Fairchild-datasheet-8321088.pdf FDC5614P-Fairchild-Semiconductor-datasheet-44355464.pdf FDC5614P FDC5614P-ON-Semiconductor-datasheet-44695.pdf FDC5614P-ON-Semiconductor-datasheet-99207043.pdf FDC5614P-ON-Semiconductor-datasheet-137405094.pdf FDC5614P-Fairchild-Semiconductor-datasheet-10848646.pdf
- Environmental InformationMaterial Declaration FDC5614P
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- ReachStatementFairchild-Semiconductor-FDC5614P.pdf
- TechnicalDrawingFairchild-Semiconductor-FDC5614P.pdf
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