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- ESD9L5.0ST5G
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ESD9L5.0ST5G Tech Specifications
ON Semiconductor ESD9L5.0ST5G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Lifecycle Status | ACTIVE (Last Updated: 4 days ago) | |
Factory Lead Time | 13 Weeks | |
Contact Plating | Tin | |
Mounting Type | Surface Mount | |
Package / Case | SOD-923 | |
Surface Mount | YES | |
Number of Pins | 2Pins | |
Diode Element Material | SILICON | |
Breakdown Voltage / V | 5.4V | |
Number of Elements | 1 Element | |
Reverse Stand-off Voltage | 5V | |
Operating Temperature | -55°C~150°C TJ | |
Packaging | Tape & Reel (TR) | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 2Terminations | |
Termination | SMD/SMT | |
ECCN Code | EAR99 | |
Type | Zener | |
Applications | General Purpose | |
Additional Feature | LOW CAPACITANCE | |
Capacitance | 900FF | |
Terminal Position | DUAL | |
Terminal Form | FLAT | |
Depth | 600μm | |
Base Part Number | ESD9 | |
Pin Count | 2 | |
Operating Supply Voltage | 5V | |
Working Voltage | 5V | |
Polarity | Unidirectional | |
Leakage Current | 1μA | |
Element Configuration | Single | |
Power Dissipation | 150mW | |
Power Line Protection | No | |
Current - Peak Pulse (10/1000μs) | 1A 8/20μs | |
Max Reverse Leakage Current | 1μA | |
Clamping Voltage | 9.8V | |
Voltage - Reverse Standoff (Typ) | 5V Max | |
Peak Pulse Current | 1A | |
Max Surge Current | 1A | |
Peak Pulse Power | 150mW | |
Halogen Free | Halogen Free | |
Test Current | 1mA | |
Rep Pk Reverse Voltage-Max | 5V | |
Capacitance @ Frequency | 0.5pF @ 1MHz | |
Reverse Breakdown Voltage | 5.8V | |
Max Breakdown Voltage | 5.4V | |
ESD Protection | Yes | |
Height | 400μm | |
Length | 800μm | |
Width | 650μm | |
REACH SVHC | No SVHC | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
ESD9L5.0ST5G Documents
Download datasheets and manufacturer documentation for ESD9L5.0ST5G
- DatasheetsESD9L
- Environmental InformationMaterial Declaration ESD9L5.0ST5G
- PCN Design/SpecificationWire Bond 01/Dec/2010 Mult Devices Tape Design 06/Mar/2018
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