BZX84C56LT1G Tech Specifications

ON Semiconductor  BZX84C56LT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Factory Lead Time 4 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Number of Elements 1 Element
Operating Temperature -65°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2007
Tolerance ±7%
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Additional Feature UL RECOGNIZED
HTS Code 8541.10.00.50
Power Rating 225mW
Voltage - Rated DC 56V
Max Power Dissipation 225mW
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BZX84C56
Pin Count 3
Working Voltage 56V
Polarity UNIDIRECTIONAL
Impedance 200Ohm
Element Configuration Single
Diode Type ZENER DIODE
Current - Reverse Leakage @ Vr 50nA @ 39.2V
Power Dissipation 300mW
Voltage - Forward (Vf) (Max) @ If 900mV @ 10mA
Max Reverse Leakage Current 50nA
Impedance-Max 200Ohm
Halogen Free Halogen Free
Test Current 2mA
Reference Voltage 56V
Forward Voltage 900mV
Zener Voltage 56V
Voltage Tol-Max 7.14%
Peak Reverse Current 50nA
Voltage Tolerance 7%
ESD Protection Yes
Zener Current 10mA
Height 1.1176mm
Length 3.0226mm
Width 1.397mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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