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BAS70-04LT1G Tech Specifications

ON Semiconductor  BAS70-04LT1G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Factory Lead Time 4 Weeks
Contact Plating Tin
Mounting Type Surface Mount
Package / Case TO-236-3, SC-59, SOT-23-3
Surface Mount YES
Number of Pins 3Pins
Diode Element Material SILICON
Breakdown Voltage / V 70V
Number of Elements 2 Elements
Packaging Cut Tape (CT)
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3Terminations
ECCN Code EAR99
Max Operating Temperature 150°C
Min Operating Temperature -55°C
Capacitance 2pF
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Current Rating 2μA
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number BAS70-04L
Pin Count 3
Element Configuration Dual
Speed Small Signal =< 200mA (Io), Any Speed
Diode Type Schottky
Current - Reverse Leakage @ Vr 10μA @ 70V
Power Dissipation 225mW
Voltage - Forward (Vf) (Max) @ If 1V @ 15mA
Forward Current 15mA
Max Reverse Leakage Current 10μA
Operating Temperature - Junction -55°C~150°C
Max Surge Current 100mA
Halogen Free Halogen Free
Current - Average Rectified (Io) 100mA DC
Forward Voltage 1V
Max Reverse Voltage (DC) 70V
Average Rectified Current 100mA
Peak Reverse Current 10μA
Max Repetitive Reverse Voltage (Vrrm) 70V
Peak Non-Repetitive Surge Current 100mA
Diode Configuration 1 Pair Series Connection
Max Forward Surge Current (Ifsm) 100mA
Height 1.016mm
Length 3.0226mm
Width 1.397mm
REACH SVHC No SVHC
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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