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IO-CPL-OMRON-KIT Tech Specifications
Omron IO-CPL-OMRON-KIT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
Mounting Type | Through Hole | |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
Number of Positions or Pins (Grid) | 24 (2 x 12) | |
Contact Material - Mating | Beryllium Copper | |
Contact Material - Post | Brass | |
Contact Finish Mating | Gold | |
Package | Bulk | |
Mfr | Omron Automation and Safety | |
Product Status | Active | |
For Use With/Related Products | - | |
Operating Temperature | -55°C ~ 125°C | |
Series | 508 | |
Packaging | Bulk | |
Part Status | Active | |
Termination | Wire Wrap | |
Type | DIP, 0.6 (15.24mm) Row Spacing | |
Current Rating | 3A | |
Pitch - Mating | 0.100 (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Resistance | -- | |
Accessory Type | I/O Coupling Kit | |
Termination Post Length | 0.500 (12.70mm) | |
Pitch - Post | 0.100 (2.54mm) | |
Features | Open Frame | |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
Contact Finish Thickness - Post | 10.0µin (0.25µm) | |
Material Flammability Rating | UL94 V-0 |
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